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Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/93
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| Title: | Ultrasonic transducer |
| Authors: | Chan, Helen L. W.
Or, Derek Siu-wing
Choy, Chung-loong |
| Subjects: | Ultrasonic transducers
Bonding tool |
| Issue Date: | 11-Sep-2001 |
| Citation: | US Patent 6,286,747 B1. Washington, DC: US Patent and Trademark Office, 2001. |
| Abstract: | A bonding tool has a driver of piezoelectric elements in a stack. A sensor is positioned and held in the stack and includes a piezoelectric element sandwiched between electrodes and insulating wafers. Voltage developed between the electrodes is monitored and used to determine a bonding parameter, including the amplitude and duration of each ultrasonic burst. |
| Rights: | Assignee: The Hong Kong Polytechnic University. |
| Type: | Patent |
| URI: | http://hdl.handle.net/10397/93 |
| Appears in Collections: | AP Patents
Patents of PolyU
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