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Title: Ultrasonic transducer
Authors: Chan, Helen L. W.
Or, Derek Siu-wing
Choy, Chung-loong
Subjects: Ultrasonic transducers
Bonding tool
Issue Date: 11-Sep-2001
Source: US Patent 6,286,747 B1. Washington, DC: US Patent and Trademark Office, 2001.
Abstract: A bonding tool has a driver of piezoelectric elements in a stack. A sensor is positioned and held in the stack and includes a piezoelectric element sandwiched between electrodes and insulating wafers. Voltage developed between the electrodes is monitored and used to determine a bonding parameter, including the amplitude and duration of each ultrasonic burst.
Rights: Assignee: The Hong Kong Polytechnic University.
Type: Patent
Appears in Collections:Patents of PolyU
AP Patents

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