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|Authors:||Chan, Helen L. W.|
Or, Derek Siu-wing
|Source:||US Patent 6,286,747 B1. Washington, DC: US Patent and Trademark Office, 2001.|
|Abstract:||A bonding tool has a driver of piezoelectric elements in a stack. A sensor is positioned and held in the stack and includes a piezoelectric element sandwiched between electrodes and insulating wafers. Voltage developed between the electrodes is monitored and used to determine a bonding parameter, including the amplitude and duration of each ultrasonic burst.|
|Rights:||Assignee: The Hong Kong Polytechnic University.|
|Appears in Collections:||Patents of PolyU|
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