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Title: Piezoelectric sensor for measuring bonding parameters
Authors: Chan, Helen L. W.
Chiu, Siu San
Or, Derek Siu-wing
Cheung, Yiu Ming
Subjects: Piezoelectric sensor
Bonding parameters measurement
Issue Date: 28-Aug-2001
Source: US Patent 6,279,810 B1. Washington, DC: US Patent and Trademark Office, 2001.
Abstract: A sensor for an ultrasonic bonding apparatus comprises a piezoelectric material located between the ultrasonic transducer and an ultrasonic concentrator of the bonding apparatus. The sensor has at least two outputs for measuring different bonding parameters, the outputs being chosen to optimize the signal response for the bonding parameters in question.
Rights: Assignee: ASM Assembly Automation LTD.
Assignee: The Hong Kong Polytechnic University.
Type: Patent
Appears in Collections:Patents of PolyU
AP Patents

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