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|Title: ||Cobalt-tungsten-phosphorus alloy diffusion barrier coatings, methods for their preparation, and their use in plated articles|
|Authors: ||Man, H. C.|
Tsui, Rick Y. C.
Yeung, Kinny L. K.
|Subjects: ||Cobalt-tungsten-phosphorus alloy|
|Issue Date: ||4-Mar-2003 |
|Citation: ||US Patent 6,528,185 B2. Washington, DC: US Patent and Trademark Office, 2003.|
|Abstract: ||Techniques are provided for electrolessly depositing and electrodepositing CoWP barrier coating onto copper or copper alloys to prevent copper diffusion when forming layers on articles such as watch bracelets, watch cases, imitation jewelry, spectacle frames and metal buttons.|
|Rights: ||Assignee: The Hong Kong Polytechnic University.|
Assignee: Hong Kong Productivity Council.
|Appears in Collections:||ABCT Patents|
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