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Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/592

Title: Sensors for automatic process control of wire bonding
Authors: Or, Derek Siu-wing
Chan, Helen L. W.
Lo, Veng-cheong
Yuen, C. W.
Subjects: Bonding
Interferometers
Process control
Real time systems
Sensors
Ultrasonic transducers
Issue Date: 1996
Publisher: IEEE
Citation: ISAF '96 : proceedings of the tenth IEEE International Symposium on Applications of Ferroelectrics, East Brunswick, NJ, U.S.A., August 18-21, 1996, p. 991-994.
Abstract: PZT sensors were installed on an ultrasonic transducer used for wire bonding in order to record ultrasonic amplitude and bonding time during the bonding process. To find an appropriate location for the sensor placement, the vibration displacement distributions of the transducer were measured using a high frequency heterodyne interferometer. The non-linear signal detected by the PZT sensor was processed and the signatures of the higher frequency harmonics were recorded and related to the bonding quality. The change in harmonic contents and its relation with bond quality will be used to develop a real-time automatic process control system for wire bonding.
Rights: © 1996 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Type: Conference Paper
URI: http://hdl.handle.net/10397/592
ISBN: 0780333551
Appears in Collections:MRC Conference Papers & Presentations
AP Conference Papers & Presentations

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