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Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/589

Title: Performance study of an ultrasonic transducer used for wire bonding
Authors: Or, Derek Siu-wing
Chan, Helen L. W.
Lo, Veng-cheong
Yuen, C. W.
Subjects: Ultrasonic transducer
Wire bonding
Piezoelectric transducers
Bonding
Finite element method
Issue Date: 1998
Publisher: IEEE
Citation: 1998 IEEE Hong Kong Electron Devices Meeting : 29 August 1998, Hong Kong University of Science and Technology : proceedings, p. 161-164.
Abstract: In-situ studies on the performance of an ultrasonic wire-bonding transducer (about 60 kHz) are presented and discussed in this paper in order to optimize the bonding process. The resonant frequencies and vibration mode shapes of the transducer were computed using finite element method (FEM) and were compared with the experimental resonant frequencies and displacement distributions. Good agreements between the computed and experimental results were obtained. The desirable second axial mode was found and proven to be the dominant mode of the transducer that facilitates the bonding process. Characteristics of the transducer under different input power were also studied. Results show that its performance is good and high quality bonds can be formed.
Rights: © 1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Type: Conference Paper
URI: http://hdl.handle.net/10397/589
ISBN: 0780349326
Appears in Collections:MRC Conference Papers & Presentations
AP Conference Papers & Presentations

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