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|Title:||Measurement of mechanical properties for dense and porous polymer films having a low dielectric constant|
Zheng, D. W.
Tu, K. N.
Ong, C. W.
|Publisher:||American Institute of Physics|
|Source:||Journal of applied physics, 15 Nov. 2000, v. 88, no. 10, p. 5744-5750.|
|Abstract:||We measured the mechanical properties of dense and porous polymeric films, the modified polyarylethers, which have a low dielectric constant varying from 2.7 to 1.8, by combining three different methods; membrane bulge test, nanoindentation, and single-substrate bending beam method. The elastic modulus and initial stress measured from these three methods are in good agreement. The substrate effect was observed in the measurements by nanoindentation. Data obtained by nanoindentation show a significant dependence on the film thickness and the displacement depth of the indenter. However, the hardness of the low dielectric constant thin film does not depend on thickness and only slightly depends on the indentation depth. A tentative analysis is proposed to explain the results.|
|Rights:||© 2000 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Y. Xu et al., J. Appl. Phys. 88, 5744 (2000) and may be found at http://link.aip.org/link/?jap/88/5744.|
|Appears in Collections:||MRC Journal/Magazine Articles|
AP Journal/Magazine Articles
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