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|Title:||Method and system for bonding electrical devices using an electrically conductive adhesive|
|Authors:||Or, Derek Siu-wing|
|Source:||US Patent 8,129,220 B2. Washington, DC: US Patent and Trademark Office, 2012.|
|Abstract:||A system for bonding electrical devices using an electrically conductive adhesive to adhere the electrical devices together, the system comprising: an ultrasonic transducer to generate an ultrasonic vibration; and an ultrasonic to thermal energy apparatus operatively attached to and covering an operational end of the ultrasonic transducer, the ultrasonic to thermal energy apparatus damping the ultrasonic vibration to minimize ultrasonic vibration transmitted to a first electrical device and causing the conversion of the ultrasonic vibration to a heating pulse which is conducted through the first electrical device to the adhesive; wherein the adhesive is softened by the heating pulse to bond the electrical devices together.|
|Rights:||Assignee: The Hong Kong Polytechnic University.|
|Appears in Collections:||EE Patents|
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