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Title: Copper thin film of alternating textures
Authors: Huang, Hanchen
Wei, H. L.
Woo, Chung-ho
Zhang, X. X.
Subjects: Copper
Metallic thin films
Sputter deposition
Crystal morphology
Scanning electron microscopy
X-ray diffraction
Atomic force microscopy
Molecular dynamics method
Surface energy
Issue Date: 16-Jun-2003
Publisher: American Institute of Physics
Source: Applied physics letters, 16 June 2003, v. 82, no. 24, p. 4265-4267
Abstract: It is common for thin films to have a predominant texture, but not alternating textures. In this letter, we report a copper film of alternating textures through self-organization. Using dc magnetron sputtering technique, we deposit copper films on a SiO₂/Si(111) substrate. A thin layer of copper of 〈111〉 texture is first developed, and another thin layer of 〈110〉 ensued. As deposition continues, a third layer of copper of 〈111〉 texture is formed on the top, leading to a sandwich copper thin film of alternating 〈111〉 and 〈110〉 textures. The film morphology is characterized with scanning electron microscopy and atomic force microscopy and the texture with x-ray diffraction. Based on anisotropic elastic analyses and molecular dynamics simulations, we propose a model of texture evolution during the formation of multilayers, attributing the texture evolution to the competition of surface and strain energies.
Rights: © 2003 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Hanchen Huang et al., Appl. Phys. Lett. 82, 4265 (2003) and may be found at
Type: Journal/Magazine Article
DOI: 10.1063/1.1583866
ISSN: 0003-6951 (print)
1077-3118 (online)
Appears in Collections:ME Journal/Magazine Articles

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