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|Title: ||Characterization of piezoelectric ring used for wire bonding transducer application|
|Authors: ||Cheng, Kei-chun|
Chan, Helen L. W.
|Issue Date: ||2001 |
|Citation: ||2001 IEEE Hong Kong Electron Devices Meeting : proceedings : 30 June 2001, The Hong Kong Polytechnic University, p. 64-67|
|Abstract: ||Resonant vibration modes excited in a
piezoelectric PZT ring which is closely
related to its geometry and dimensions were
studied. By a thinning test of the ring, the
electromechanical properties of the ring were measured as a function of its thickness and shifts in resonance vibrations were noted. Thickness of the ring was also optimized in relation to the electromechanical performance of the ring used for wire bonding application.|
|Rights: ||© 2001 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
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|Type: ||Conference Paper|
|Appears in Collections:||MRC Conference Papers & Presentations|
AP Conference Papers & Presentations
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