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Title: Characterization of piezoelectric ring used for wire bonding transducer application
Authors: Cheng, Kei-chun
Chan, Helen L. W.
Subjects: Piezoelectric
Issue Date: 2001
Publisher: IEEE
Source: 2001 IEEE Hong Kong Electron Devices Meeting : proceedings : 30 June 2001, The Hong Kong Polytechnic University, p. 64-67
Abstract: Resonant vibration modes excited in a piezoelectric PZT ring which is closely related to its geometry and dimensions were studied. By a thinning test of the ring, the electromechanical properties of the ring were measured as a function of its thickness and shifts in resonance vibrations were noted. Thickness of the ring was also optimized in relation to the electromechanical performance of the ring used for wire bonding application.
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Type: Conference Paper
ISBN: 0-7803-6714-6
Appears in Collections:MRC Conference Papers & Presentations
AP Conference Papers & Presentations

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