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Title: Bone reposition device, method and system
Authors: Koo, Kwok-keung Terry
Mak, Arthur F. T.
Chao, Edmund Yee-su
Issue Date: 1-Feb-2011
Source: US Patent 7,881,771 B2. Washington, DC: US Patent and Trademark Office, 2011.
Abstract: A bone reposition device includes first and second bone supports for supporting first and second portions of a fracture or osteotomize bone about a fracture or osteotomize site, a plurality of sequentially connected connection members and a plurality of joints each with at least a pair of adjacent parts for connecting the connection members therebetween and to the first and second bone supports. The plurality of joints includes at least six joints, each of which possesses one degree of freedom and allows controllable relative rotation or translation of said pair of adjacent parts about one of three axes respectively.
Rights: Assignee: The Hong Kong Polytechnic University.
Type: Patent
Appears in Collections:Patents of PolyU
HTI Patents

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