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|Title: ||Method and apparatus for measuring oscillation amplitude of an ultrasonic device|
|Authors: ||Chan, Helen L. W.|
|Issue Date: ||26-Oct-2010 |
|Citation: ||US Patent 7,819,013 B2. Washington, DC: US Patent and Trademark Office, 2010.|
|Abstract: ||An apparatus and method for detecting the oscillation amplitude of a bonding tool includes a sensing unit disposed adjacent to and at a distance from the bonding tool. The sensing unit includes a pair of electrodes, a piezoelectric sensing layer located between the pair of electrodes, and a membrane associated with the piezoelectric sensing layer. The piezoelectric sensing layer becomes sensitive to ultrasonic vibrations and generates electrical voltage signals after being activated by a poling process. An optional pre-amplifier is used to amplify the signals generated from the sensing unit, and an oscilloscope is used to further process the signals.|
|Rights: ||Assignee: The Hong Kong Polytechnic University.|
|Appears in Collections:||AP Patents|
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