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Title: Method and apparatus for measuring oscillation amplitude of an ultrasonic device
Authors: Chan, Helen L. W.
Lam, Tin-yan
Chao, Chen
Kwok, Kin-wing
Issue Date: 26-Oct-2010
Source: US Patent 7,819,013 B2. Washington, DC: US Patent and Trademark Office, 2010.
Abstract: An apparatus and method for detecting the oscillation amplitude of a bonding tool includes a sensing unit disposed adjacent to and at a distance from the bonding tool. The sensing unit includes a pair of electrodes, a piezoelectric sensing layer located between the pair of electrodes, and a membrane associated with the piezoelectric sensing layer. The piezoelectric sensing layer becomes sensitive to ultrasonic vibrations and generates electrical voltage signals after being activated by a poling process. An optional pre-amplifier is used to amplify the signals generated from the sensing unit, and an oscilloscope is used to further process the signals.
Rights: Assignee: The Hong Kong Polytechnic University.
Type: Patent
Appears in Collections:Patents of PolyU
AP Patents

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