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Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/1764
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| Title: | Electronic circuit board |
| Authors: | Cheng, K. W. Eric
Tang, Chak-yin |
| Issue Date: | 9-Mar-2010 |
| Citation: | US Patent 7,675,401 B2. Washington, DC: US Patent and Trademark Office, 2010. |
| Abstract: | A circuit board, for an electronic circuit having a passive circuit component, has a component region, a non-component region, and circuit wiring conductors on its surface. The component region includes a polymer composition comprising a mixture of polymer resin and filler material that, in combination with the circuit wiring conductors, forms the passive circuit component. |
| Rights: | Assignee: The Hong Kong Polytechnic University. |
| Type: | Patent |
| URI: | http://hdl.handle.net/10397/1764 |
| Appears in Collections: | EE Patents
Patents of PolyU
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