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Title: Ultrasonic transducer
Authors: Chan, Helen L. W.
Or, Derek Siu-wing
Cheng, Kei-chun
Choy, Chung-loong
Subjects: Ultrasonic transducers
Bonding tool
Issue Date: 20-Feb-2001
Source: US Patent 6,190,497 B1. Washington, DC: US Patent and Trademark Office, 2001.
Abstract: A bonding tool for applying pressure and ultrasonic energy simultaneously to join miniature components together includes an ultrasonic driver having four composite wafers separated by electrodes. Such bonding tools are known that use wafers made of wholly of ceramic material. By using wafers having four sector parts of ceramic material separated by layers of polymer as shown, bonding tools are provided with broader bandwidth operation and reduced spurious resonance modes.
Rights: Assignee: The Hong Kong Polytechnic University.
Type: Patent
Appears in Collections:Patents of PolyU
AP Patents

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