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Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/132

Title: Complex waveform electroplating
Authors: Chan, Kang-cheung
Yung, Kam-chuen Winco
Yue, Tai-man
Subjects: Waveform electroplating
Issue Date: 19-Jul-2005
Citation: US Patent 6,919,011 B2. Washington, DC: US Patent and Trademark Office, 2005.
Abstract: A method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex current waveform between the anode nodes and the object. The waveform is a cyclic alternating type having two portions, a positive triangular shaped portion including one or more spikes and a negative portion. The method further includes vibrating the object and/or agitating the bath solution.
Rights: Assignee: The Hong Kong Polytechnic University.
Type: Patent
URI: http://hdl.handle.net/10397/132
Appears in Collections:ISE Patents
Patents of PolyU

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