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|Title: ||Complex waveform electroplating|
|Authors: ||Chan, Kang-cheung|
Yung, Kam-chuen Winco
|Subjects: ||Waveform electroplating|
|Issue Date: ||19-Jul-2005 |
|Citation: ||US Patent 6,919,011 B2. Washington, DC: US Patent and Trademark Office, 2005.|
|Abstract: ||A method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex current waveform between the anode nodes and the object. The waveform is a cyclic alternating type having two portions, a positive triangular shaped portion including one or more spikes and a negative portion. The method further includes vibrating the object and/or agitating the bath solution.|
|Rights: ||Assignee: The Hong Kong Polytechnic University.|
|Appears in Collections:||ISE Patents|
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