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|Title:||Complex waveform electroplating|
Yung, Kam-chuen Winco
|Source:||US Patent 6,919,011 B2. Washington, DC: US Patent and Trademark Office, 2005.|
|Abstract:||A method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex current waveform between the anode nodes and the object. The waveform is a cyclic alternating type having two portions, a positive triangular shaped portion including one or more spikes and a negative portion. The method further includes vibrating the object and/or agitating the bath solution.|
|Rights:||Assignee: The Hong Kong Polytechnic University.|
|Appears in Collections:||Patents of PolyU|
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