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Showing results 1 to 6 of 6
Issue DateTitleAuthor(s)
2004 Advanced transducer technologies for electrical connections in microelectronic packagingLi, Hing-leung
May-2011 Broad-band and high-temperature ultrasonic transducer fabricated using a Pb(In[sub ½]Nb[sub ½])-Pb(Mg[sub ⅓]Nb[sub ⅔])-PbTiO₃ single crystal/epoxy 1–3 compositeZhou, Dan; Cheung, Kwok Fung; Lam, Kwok-ho; Chen, Y.; Chiu, Yat Ching; Dai, Jiyan; Chan, Helen L. W.; Luo, Haosu
2008 Development of lead-free ultrasonic wirebonding transducers for microelectronic packaging applicationsLee, Tact
Oct-2011 Particle trapping for acoustic tweezersYu, Yanyan; Qiu, Weibao; Sun, Lei
1-Oct-1996 Polarization of thick polyvinylidene fluoride/trifluoroethylene copolymer filmsChan, Helen L. W.; Zhao, Z.; Kwok, Kin-wing; Choy, Chung-loong; Alquié, C.; Boué, C.; Lewiner, J.
2005 Study of magnetoelectric composites for sensor and transducer applicationsLi, Tongle
Showing results 1 to 6 of 6

 

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